Dual-Coat and Tri-Coat Electroplating on Wire

Dual-Coat and Tri-Coat Wire Electroplating protects and enhances

Dual-coat and multi-coat electroplating of wire at Summit Plating is a process that provides a protective inner barrier or barriers to enhance or maintain function. Multi-layer electroplating allows the outer plating surface metal to retain important performance characteristics that might otherwise be compromised by inter-metallic interaction between the base wire and outer plating.

Multi-Layer Electroplating for more precise performance control

Dual-Coat Electroplating can also be administered to incrementally increase electrical conductivity, retain solder-ability, improve corrosion and wear resistance, and more. Tri-Coat adds a base layer, intermediate layer, and surface layer to further enhance those performance characteristics and further improve durability according to specification needs.