Tin Electroplating of Round Wire
Tin Electroplating of wire at Summit Plating is an economical solution for improving connective usability and durability.
Tin Electroplating characteristics
Tin electroplating enhancements include increased operating temperature range and improved solder-ability. Tin plating on certain wires, (especially Copper) does have a limited solder-ability shelf-life due to an inter-metallic interaction that naturally occurs over time between the base wire and the tin coating. If considering this option, it should be noted that proper packaging can significantly extend the shelf life of Tin Plated Wire.